November 2, 2016 - Oak Ridge National Laboratory will lead the 13th international conference on Thermal Performance of the Exterior Envelopes of Whole Buildings XIII on December 5-8 in Clearwater, Florida, an event that attracts building envelope experts from around the world to share state-of-the-art research and technology applications. One topic of interest will be a mold growth index model workshop, explaining the model’s development and application and providing examples of how MGI usage could vary depending on building materials. The MGI model is expected to become a new buildings standard. Along with ORNL, the event’s sponsors this year include the Department of Energy, National Institute of Building Sciences and the American Society of Heating, Refrigerating and Air-Conditioning Engineers. Since 1989, ORNL has led the event known as the Buildings 13 Conference, which occurs every three years.
